University of Arkansas

Research Frontiers

Fall 2009

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Advanced Electronic Packaging has helped thousands of students and practicing engineers understand the complex task of connecting integrated circuits and other electronic components to make virtually every electronic device, including cell phones, video games, computers and military- and medical-imaging equipment.

For seven years, Advanced Electronic Packaging has served as a popular, graduate-level textbook and the industry-standard reference manual. Each chapter was authored by one or more acknowledged experts and then edited to ensure consistency throughout the book. In addition to offering a comprehensive overview of electronic packaging, the second edition contains new chapters on passive devices, radio-frequency and microwave packaging, electronic package assembly, and cost evaluation and assembly. Organic and ceramic substrates, formerly covered within other chapters, now have their own chapters.

This book, which includes many examples and exercises, was written as a teaching text. But industry leaders also have praised the book as a thorough examination of all areas of electronic packaging and an invaluable reference tool.

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